Physical Sciences › Engineering › Electrical and Electronic Engineering
Electronic Packaging and Soldering Technologies
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Neueste Paper
- Failure Analysis in Transition: An Industry Survey of Challenges, Priorities, and Standardization Needs in Advanced Packaging and Heterogeneous Integration
Himanandhan Reddy Kottur, Nusra Akter Takia, Mahamudul Hassan Fuad, Istiaq Firoz Shiam, Matthew Walsh, Navid Asadizanjani · 23. Juni 2026
Failure analysis is being reshaped by heterogeneous integration, chiplet-based architectures, hybrid bonding, backside technologies, & increasingly buried package structures. To examine how practitioners view this transition, an anonymous survey was distributed across a broad set of organizations in…
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